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楼主 |
发表于 2002-11-22 13:18:00
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谢谢以上各位的指导。现在说明一下我的板子的功能,我自己用微加工做了一块芯片,但是芯片有100个
管脚(呵呵,因为用途特殊,所以比较多)所以想画一块PCB板子,将芯片管脚通过压焊的方法焊在PCB焊
盘上,然后通过PCB板接到信号源上,中间的矩形筐就是我要放自己的片子的地方,外围较粗的两个红线
是顶层的两个信号总线,两根蓝线是底层底信号总线,较细底红线从焊盘引出,每隔一根分别接到顶层和
底层底总线上,这里不存在电源和地线什么的,也没有其它的元器件。
DRC错误如下,请指教!
我是一只很菜底鸟,刚学pcb,所以可能会犯常识性错误,请大家多多指教
请指教我在EDA应用技术交流栏提出底问题
Protel Design System Design Rule Check
PCB File : fianl test
Date : 21-Nov-2002
Time : 16:37:15
Processing Rule : Short-Circuit Constraint (Allowed=Not Allowed) (On the board ),(On the
board )
Violation between Track (18499.764mil,26346.457mil)(18499.764mil,27736.764mil) TopLayer
and
Pad Designator27-76(18499.764mil,26346.457mil) TopLayer
Violation between Track (18883.724mil,26282mil)(18883.724mil,26916.094mil) TopLayer and
Pad Designator27-61(18883.622mil,26287.402mil) TopLayer
Violation between Track (19139.63mil,26282mil)(19139.63mil,26422mil) TopLayer and
Pad Designator27-51(19139.528mil,26287.402mil) TopLayer
Violation between Track (19088.449mil,26282mil)(19088.449mil,26520.819mil) TopLayer and
Pad Designator27-53(19088.346mil,26287.402mil) TopLayer
Violation between Track (18141.496mil,24816.496mil)(18141.496mil,25440.945mil) TopLayer
and |
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