[原创][PCB新手看过来]POWER PCB内层属性设置与内电层分割及铺铜

hgjchz

DING!

wmjk2004

頂﹗樓主也是做Card reader的﹖

叶落天涯

以下是引用大虾教菜鸟在2004-12-22 9:53:21的发言： 我用力顶,看拉楼主的文章,以前的一点小疑问迎刃而解,感谢啊,我再顶,问一下,这几个铜皮之间的安全间距是不是就是布线规则中的铜皮对其他所有对象的安全间距啊?

第一次切割的绿色网络间距与当前切割的铜皮线宽相同，第二次切割的铜皮间距由PREFERENCE-SPLIT/MIXED PLANE-AUTO SEPARATE控制，切割前即要设定好尺寸，不要用RULES来限制，否则会与外层铺铜设定发生干涉。

叶落天涯

以下是引用wmjk2004在2004-12-22 13:07:26的发言： 頂﹗樓主也是做Card reader的﹖

这板不是我做的。是从其他帖子里下载的，只是拿过来切两刀示范一下。[em05]

冰焰

支持支持

厦门菜

顶～～

volcanolmy

前面分割我按照所说作下来，感觉不错

但在用POUR MANAGER-PLANE CONNECT进行灌铜时出现如下错误，怎么回师啊？

THERMAL RELIEF ERRORS REPORT -- strong21_LMY.pcb -- Fri Dec 24 15:13:17 2004

Drilled pads with Nondrilled pads with less than 50% thermal extensions less than 50% thermal extensions

Report of Thermal Spokes Generator.

On vcc: (21312, 13428) # = 0 JP3.9 (21600, 14200) # = 0 U18.8 (18726, 14004) # = 0 (24378, 14898) # = 0 (23628, 14706) # = 0 (23292, 14628) # = 0 (18828, 13290) # = 0 (18612, 12666) # = 0 (18240, 13242) # = 0 (18378, 12906) # = 0 (18078, 12120) # = 0 (18024, 13494) # = 0 (17760, 12756) # = 0 (17730, 13374) # = 0 (17730, 13110) # = 0 U28.3 (24078, 14418) # = 0 U27.3 (23706, 14424) # = 0 U26.2 (24913, 14196) # = 0 (20616, 13008) # = 0 (20916, 13428) # = 0 (21636, 12990) # = 0 (21348, 12408) # = 0 (21096, 12408) # = 0 (21540, 14838) # = 0 J16.2 (24544, 14088) # = 0 (21006, 14802) # = 0 (21006, 14502) # = 0 (21174, 14370) # = 0 (20436, 14628) # = 0 (20148, 14388) # = 0 JP4.18 (19900, 13100) # = 0 JP3.29 (20600, 14200) # = 0 JP2.22 (22200, 13000) # = 0 JP1.34 (21700, 11800) # = 0 JP1.21 (21100, 11700) # = 0 (21372, 13512) # = 0 J15.2 (24532, 14226) # = 0 JP3.6 (21800, 14100) # = 0 (19458, 14022) # = 1 (20616, 13266) # = 0 (24594, 11994) # = 0 (21540, 14664) # = 0 (20430, 14490) # = 0 JP2.7 (22300, 12300) # = 0

Total Drilled pads: 44 Total Nondrilled pads: 0

Report of Violating Thermal Spokes Remover.

On vcc: (19416, 12390) # = 1 (22506, 12294) # = 1 (22926, 11850) # = 1 (24258, 13182) # = 1

Total Drilled pads: 4 Total Nondrilled pads: 0

[em07][em07][em07]

叶落天涯

第一项报告：因为你的铺铜范围没有覆盖到足够的面积，导致无法生成足够的散热焊盘导通脚（SPOKE)。

第二项报告：虽然生成了足够的导通脚，但是由于违反规则而必须移除某些导通脚。一般是因为其他过孔与散热焊盘距离太近所致。

tommoney

小妹蠻歷害的嗎

48877193

[em05]